Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.
Supports everything from single-sided substrates to flexible substrates using Roll to Roll!
This is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =
- 企業：フジ機工
- 価格：Other
